STS and University of Alaska Fairbanks enters in an exclusive agreement to supply High Reliability 3D stacked products to Aerospace & DOD customers, utilizing Tessera's Inc., CSP and stacking technology.
Bartt Richards Sr., Design Engineering Manager; NEC Electronics America, Inc.
"Despite our constantly changing schedule and the short notice times that we gave for providing wafers to you, STS was able to complete the order in a remarkable 8 hours (as opposed to the quoted 1~2 days)."
Al Vindasius, President and CEO; Madho Dhouni, VP Marketing & Engineering, Vertical Circuits, Inc.
"The Quality of work is unsurpassed and the Engineering and Manufacturing support has always been excellent. The internal tracking and traveler system in support of both Engineering and Manufacturing product flow is "state of the art". STS's dedication has helped VCI maintain a competitive edge, qualify and supply leading edge memory and special microcircuit function products to our valued customers."
Joseph Smith, Engineering, National Semiconductor
"STS was instrumental in developing a method of building a PBGA package without Molding. This allowed National to procure substrates from our customer and build fast track Prototypes. Many thanks to the Design team for producing a packaging concept that worked first time and in the time to meet our critical schedule, and the effort of everyone involved in the manufacturing process that supported the effort of the project."
